青云翻译

Chip surface normal no cracks, no golden goal off the second spot with a loss. The second place spot covered with black material, decap process is difficult to remove.

The chip surface normal crack-free, Golden Globe no clear fall off, the second spot with one loss. Second weld locations covered with a layer of black material, decap process it is difficult to remove.

The chip surface does not have the crack normally, Jin Qiuwu falls off obviously, the second spot has to fall off.The second spot position covers black material, in the decap process removes with difficulty.

chip surface normal no crack, there is no clear golden ball fell off the 2 solder, there is a fall off. Solder 2 location covered with a layer decap black substance in the process, it is difficult to remove.

The chip surface normal crack-free, Golden Globe no clear fall off, the second spot with one loss. Second weld locations covered with a layer of black material, decap process it is difficult to remove.