青云翻译

Solid solution matrix grain size, grain polygonal or equiaxed. w-re the connection between the alloy matrix grain is high, individual small grains merge to form larger grain size, grain size between about 10 ? 25μm. However, due to shorter holding time, sintering temperature is low, you can still ob

Matrix solid solution Crystal small grains of polygon or isometric. W-Re connection between grains of high alloy substrate, individual small grains merging to form larger grains, grain size of about 10 per cent between 25 μ m. But because of the relatively short holding time and sintering temperatur

The substrate solid solution crystal grain is tiny, the crystal grain assumes the polygon or the isometry shape.Between the W-Re alloy substrate crystal grain the connection is high, the individual small crystal grain merge forms the slightly great size crystal grain, the grain size is approximately

Small, die die blanks petition epitaxy devices for optoelectronic applications such as polygons or shaft. rondelles W - Re alloy matrix connections between individual small rondelles are relatively high, combined forming a slightly larger size die to die size is about 10 to 25 ?m between ?. But beca

Matrix solid solution Crystal small grains of polygon or isometric. W-Re connection between grains of high alloy substrate, individual small grains merging to form larger grains, grain size of about 10 per cent between 25 μ m. But because of the relatively short holding time and sintering temperatur