青云翻译

If the chip pads and other devices to allow the spacing between the pads case, the pad inserted between the solder.

If the chip pads of pads and other devices allowed the spacing between cases, joined the solder between the pads.

If the chip welds between the plate and other components welds between the plate in the spacing permission situation, please in weld between the plate to join the anti- solder.

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If the chip pads of pads and other devices allowed the spacing between cases, joined the solder between the pads.