青云翻译

A large number of charged particles perpendicular to the wafer surface by the electric field acceleration, normal incidence to the wafer surface, to etch larger physical momentum, and they also occurred with intense film surface chemical reaction, chemical etching effect.

A large number of charged particles by electric field perpendicular to the surface of silicon chip to speed up, normal incidence to the wafer surface, physically etched in greater momentum, at the same time it also works with films that a strong reaction, chemical etching effect.

The massive charged particles are been vertical to the silicon chip surface electric field acceleration, the normal incidence to the silicon chip surface on, carries on the physical sculpture by the big momentum, simultaneously they also have the intense chemical reaction with the thin film surface,

large particles are perpendicular to the electric field silicon chip surface vertical x10, accelerate the silicon chip on the surface, with a greater momentum in physics etching, and at the same time, they also strongly the chemical reactions occur with thin-film surface, and produce chemical etchin

A large number of charged particles by electric field perpendicular to the surface of silicon chip to speed up, normal incidence to the wafer surface, physically etched in greater momentum, at the same time it also works with films that a strong reaction, chemical etching effect.